Qualcomm is hiring for the position of Interim Engineering Intern in Bangalore; Hyderabad; Chennai; Noida, India. Candidates with Bachelor’s/ Master’s Degree are eligible to apply for this position. The complete information, eligibility criteria, and requirements are provided below.
Job Description:
Company Name | Qualcomm |
Position | Interim Engineering Intern – SW |
Qualifications | Bachelor’s/ Master’s Degree |
Batch | 2023/ 2024/ 2025/ 2026/ 2027 |
Experience | Freshers |
Location | Hyderabad / Bangalore / Chennai / Noida |
Key Responsibilities:
- Design and develop software for Qualcomm’s mobile chipsets using cutting-edge technology.
- Work on various technologies, including:
- Multimedia Technologies – Audio and video codecs, image processing.
- Wireless Modem Technologies – 4G, WiFi, Bluetooth, and self-organizing networks.
- Platform-Level Software – Linux, Android, Windows, and board support packages.
- IoT Technologies – Connected cameras, smart assistants, drones, virtual reality, and augmented reality.
Responsibilities for Campus Graduates:
- Develop real-time embedded software and device drivers.
- Work on mobile software development for Windows Mobile, Android, or Linux.
- Apply a strong understanding of OS concepts and data structures.
- Utilize C/C++ and object-oriented design for software development.
- Work with wireless network standards such as CDMA, GSM, UMTS, and LTE.
- Contribute to Linux/UNIX development, including Linux drivers and kernel development.
- Implement and optimize communication protocols such as TCP, UDP, IP, SIP, and RTP.
- Develop multimedia technologies, including audio, video, and imaging solutions.
- Apply strong analytical and problem-solving skills in software development.
- Collaborate effectively with cross-functional teams.
- Communicate technical ideas clearly through verbal and written communication.
Opportunities Include:
- Software development for Android and Windows Mobile-based embedded platforms.
- Development of multimedia software stacks, firmware, and device drivers.
- Wireless modem and connectivity software and firmware development.
- Communication protocol stack software development.
- Kernel, board support package (BSP), and device driver development.
- Application software and UI development.
- Embedded device software architecture for Android and Windows platforms.
- Design and development using object-oriented programming principles.
Eligibility Criteria:
- Bachelor’s or Master’s degree in Computer Science Engineering, Communication Engineering, or Electronics and Communication Engineering (ECE).
About Company:
We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal – we invent breakthrough technologies that transform how the world connects, computes, and communicates.
How To Apply?
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